SMDComponent Placement

Pfeffer M, Franke J (2019)

Publication Type: Authored book

Publication year: 2019

Publisher: Springer Berlin Heidelberg

ISBN: 9783662531204

Abstract

The placement of surface mount technology (SMT) components on printed circuit boards (PCB) and its assembly task is defined as follows: Grip the right component from the pick-up position (respectively feeder) Place the component on the right position (target position) on the surface of printed circuit boards (PCB) with appropriate precision and accuracy

Authors with CRIS profile

Michael Pfeffer Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

How to cite

APA:

Pfeffer, M., & Franke, J. (2019). SMDComponent Placement. Springer Berlin Heidelberg.

MLA:

Pfeffer, Michael, and Jörg Franke. SMDComponent Placement. Springer Berlin Heidelberg, 2019.

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