Hahn L, Bader T, Pfahler T, Gloßner M, Vossiek M (2025)
Publication Type: Conference contribution
Publication year: 2025
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: EuCAP 2025 - 19th European Conference on Antennas and Propagation
Event location: Stockholm, SWE
ISBN: 9788831299107
DOI: 10.23919/EuCAP63536.2025.10999946
This paper presents a novel, 3D-printed dielectric packaging approach for application as sub-THz antenna-inpackage (AiP) solution. The application of the dielectric AiP to an on-chip antenna results in a considerable enhancement in gain and efficiency when compared to non-packaged antennas. In comparison to more complex LTCC- or glass-based packaging solutions, the proposed dielectric AiP requires only a single material that can be produced at a low cost and with minimal effort through the use of 3D-printing. Due to the homogeneity of the package, system complexity is significantly reduced. The AiP approach is benchmarked against conventional dielectric rod antennas, which were also fabricated and characterized as part of this work. This is essential for sub-THz radar camera systems, whose low gain on-chip antennas are usually insufficient. The package approach also provides increased chip protection, as well as cost-effective manufacturing and greatly simplified assembly.
APA:
Hahn, L., Bader, T., Pfahler, T., Gloßner, M., & Vossiek, M. (2025). An Additively Manufactured 300 GHz Dielectric Rod Antenna Packaging for Sub-THz Radar Camera Applications. In EuCAP 2025 - 19th European Conference on Antennas and Propagation. Stockholm, SWE: Institute of Electrical and Electronics Engineers Inc..
MLA:
Hahn, Leonhard, et al. "An Additively Manufactured 300 GHz Dielectric Rod Antenna Packaging for Sub-THz Radar Camera Applications." Proceedings of the 19th European Conference on Antennas and Propagation, EuCAP 2025, Stockholm, SWE Institute of Electrical and Electronics Engineers Inc., 2025.
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