(1999)
Publication Type: Thesis
Publication year: 1999
Publisher: Meisenbach
Edited Volumes: Fertigungstechnik - Erlangen 90
Micro-connection technology within electronics production has been characterized by a trend towards miniaturization and the demand for increased process reliability, productivity and quality. Conventional processes reach their limits when processing multi-pole electronic components with pitches of <400 µm. In order to be able to show to what extent laser beam soldering has the potential to shift this technological limit, system and process engineering studies were carried out using a micro-machining system set up as part of the work. The joining process was considered to be an integral part of the entire production process in order to show the effects of the material properties and the process parameters in their cross-process effects. The focus was on shortening the process times and the joining result achieved with laser beam soldering. The use of massive solder deposits in combination with a force-correlated assembly made it possible to achieve well-wetted solder joints for joining times <10 ms. The investigated process sequence consisted of the sub-processes reshaping the component connections, assembling the component on the circuit board and joining the connections to the landing areas of the circuit board.