(2002)
Publication Type: Thesis
Publication year: 2002
Publisher: Meisenbach
Edited Volumes: Fertigungstechnik - Erlangen 125
The trends in continuous miniaturization, high-temperature strength and environmentally friendly product design in electronics production open up a great deal of potential in the field of assembly and connection technology for laser-based selective joining processes. The book provides information on the influence of various process parameters in laser beam micro-soldering and micro-welding, the possibilities of process optimization, the achievable joining qualities as well as the reliability and aging resistance of the micro-joints. In addition, an FE view of the reliability simulation provides a comparative insight into the service life of the joints. This makes it possible to easily assign the laser beam micro-soldering and micro-welding the different application requirements.