On-Chip Antenna for Electronic Photonic Integrated D-Band Wireless Applications
Tas D, Breun S, Hagelauer A, Dietz M, Weigel R (2024)
Publication Type: Conference contribution
Publication year: 2024
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 124-126
Conference Proceedings Title: Asia-Pacific Microwave Conference Proceedings, APMC
Event location: Bali, IDN
ISBN: 9798350363548
DOI: 10.1109/APMC60911.2024.10867795
Abstract
This paper presents the implementation of an on-chip double folded dipole antenna using backside etching technique derived from a silicon photonic SiGe BiCMOS approach. Silicon photonics have found extensive utilisation in communication data center applications however there is not much research for wireless communication, radar and sensing applications. In this paper, a folded dipole antenna, by the etching the electronic photonic technology, targeting the frequency bandwidth the mid of D-Band has been designed and measured on the wafer prober. To the best of the authors knowledge, it is the first on-chip D-Band antenna for EPIC process.
Involved external institutions
Germany (DE)How to cite
APA:
Tas, D., Breun, S., Hagelauer, A., Dietz, M., & Weigel, R. (2024). On-Chip Antenna for Electronic Photonic Integrated D-Band Wireless Applications. In Asia-Pacific Microwave Conference Proceedings, APMC (pp. 124-126). Bali, IDN: Institute of Electrical and Electronics Engineers Inc..
MLA:
Tas, Deniz, et al. "On-Chip Antenna for Electronic Photonic Integrated D-Band Wireless Applications." Proceedings of the 2024 IEEE Asia-Pacific Microwave Conference, APMC 2024, Bali, IDN Institute of Electrical and Electronics Engineers Inc., 2024. 124-126.
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