A Broadband Sub-THz Push-Push Frequency Doubler in 22 nm FDSOI

Scheller K, Engelmann A, Hetterle P, Weigel R, Schrotz AM, Fischer G (2025)

Publication Type: Conference contribution, Conference Contribution

Publication year: 2025

Publisher: IEEE

Event location: San Juan PR

ISBN: 979-8-3315-4040-1

URI: https://ieeexplore.ieee.org/document/10880553

DOI: 10.1109/LAMC63321.2025.10880553

Abstract

This paper presents a sub-THz push-push frequency doubler with a D-band power amplifier (PA) chain demonstrated in a 22 nm fully-depleted silicon-on-insulator (FDSOI) technology. The D-band PA comprises three common-source (CS) driver stages and a high-power stacked output stage. The amplifier stages utilize the capacitive neutralization technique for gain-boosting. Two parallel push-push doubler stages are employed
after the PA. The input power distribution and matching to the PA optimum load-pull point are achieved by leveraging an area-efficient stacked transformer with two secondary coils. The overall circuitry occupies a compact core area of 0.0625 mm2. The PA and frequency doubler attains a maximal gain of 7 dB and a saturated output power Psat of -5 dBm, covering a 60 GHz 3 dB-bandwidth. Furthermore, the circuits exhibits a minimum suppression of 35 dBc to the fundamental frequency. The circuit’s DC-power consumption is below 230 mW, supplied by 1.6 V and 0.8 V.

Authors with CRIS profile

Kai Scheller Lehrstuhl für Intelligente Technische Elektronik und Systeme Andre Engelmann Lehrstuhl für Intelligente Technische Elektronik und Systeme Philip Hetterle Lehrstuhl für Intelligente Technische Elektronik und Systeme Robert Weigel Technische Fakultät Albert-Marcel Schrotz Lehrstuhl für Intelligente Technische Elektronik und Systeme Georg Fischer Professur für Technische Elektronik

Related research project(s)

Terahertz Digital Chess-Board-Modulated Spread-Spectrum System for Radar and Communication Comprising 200 GHz Bandwidth Integrierte Terahertz-Systeme mit neuartiger Funktionalität (INTEREST) Jan. 1, 2022 - Jan. 1, 2025

How to cite

APA:

Scheller, K., Engelmann, A., Hetterle, P., Weigel, R., Schrotz, A.-M., & Fischer, G. (2025). A Broadband Sub-THz Push-Push Frequency Doubler in 22 nm FDSOI. In Proceedings of the IEEE MTT-S Latin America Microwave Conference (LAMC-2025). San Juan, PR: IEEE.

MLA:

Scheller, Kai, et al. "A Broadband Sub-THz Push-Push Frequency Doubler in 22 nm FDSOI." Proceedings of the IEEE MTT-S Latin America Microwave Conference (LAMC-2025), San Juan IEEE, 2025.

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