Hahn L, Pfahler T, Bader T, Gold G, Vossiek M, Carlowitz C (2024)
Publication Type: Conference contribution
Publication year: 2024
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024
Event location: Tel Aviv, ISR
ISBN: 9798350348187
DOI: 10.1109/COMCAS58210.2024.10666228
This paper reports on 3D-printed dielectric image lines for low-loss subTHz applications between 140 and 220 GHz. In contrast to conventional dielectric waveguides, a conductive copper substrate is used to achieve robust routing and increased mechanical stability. For easy integration and characterization of the dielectric image line within a waveguide measurement setup, a low-loss mode-converter for flexible mounting is further designed. The characterized overall system exhibits a broadband match of at least 20 dB over the entire frequency band, with minimal losses of below 0.35 dB/cm. Furthermore, multi-line characterization is performed for de-embedding the propagation parameters α and β of both the dielectric transmission line and the mode-converter, and finally, the influence of discontinuities such as bending radii on the transmission behavior is evaluated. Due to the simplicity of the underlying 3D-printing technology, the proposed concept features extremely low cost and complexity, yet offers high flexibility and outperforms the losses of conventional transmission lines.
APA:
Hahn, L., Pfahler, T., Bader, T., Gold, G., Vossiek, M., & Carlowitz, C. (2024). 3D-Printed Dielectric Image Lines Towards Chip-to-Chip Interconnects for subTHz-Applications. In 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024. Tel Aviv, ISR: Institute of Electrical and Electronics Engineers Inc..
MLA:
Hahn, Leonhard, et al. "3D-Printed Dielectric Image Lines Towards Chip-to-Chip Interconnects for subTHz-Applications." Proceedings of the 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024, Tel Aviv, ISR Institute of Electrical and Electronics Engineers Inc., 2024.
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