Towards 3D-Printed Antenna in Package Solutions for THz-Applications

Pfahler T, Gold G, Hofmann A, Schür J, Vossiek M (2024)

Publication Type: Conference contribution

Publication year: 2024

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024

Event location: Tel Aviv

ISBN: 9798350348187

DOI: 10.1109/COMCAS58210.2024.10666255

Abstract

This work investigates the feasibility of 3D-printing packages for integrated circuits (IC) with built-in functional structures. The principle is demonstrated with a 300 GHz package integrated horn antenna. The horn in package is used for beamforming and antenna gain enhancement of system-on-chip (SoC) solutions and is fed by an on-chip patch antenna implemented in Backend-of-line (BEOL). The paper highlights the design process of the on-chip driver element, the 3D-printed package, and the assembly of the module. The functionality of the on-chip antenna, waveguide package horn and assembly is verified by measurement characterization. Furthermore, the limitations of current 3D-printing technologies in terms of resolution capabilities and the advantages of 3D-printed IC-packages, encapsulations, and interconnects for future wideband communications and high-resolution radar sensor applications above 300 GHz will be discussed.

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How to cite

APA:

Pfahler, T., Gold, G., Hofmann, A., Schür, J., & Vossiek, M. (2024). Towards 3D-Printed Antenna in Package Solutions for THz-Applications. In 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024. Tel Aviv, IL: Institute of Electrical and Electronics Engineers Inc..

MLA:

Pfahler, Tim, et al. "Towards 3D-Printed Antenna in Package Solutions for THz-Applications." Proceedings of the 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024, Tel Aviv Institute of Electrical and Electronics Engineers Inc., 2024.

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