Ramasubbu G, Kaup A, Herglotz C (2024)
Publication Type: Conference contribution, Conference Contribution
Publication year: 2024
Conference Proceedings Title: 2024 IEEE 26th International Workshop on Multimedia Signal Processing (MMSP)
Event location: Purdue University, West Lafayette, Indiana, USA
Open Access Link: https://arxiv.org/abs/2410.01158
APA:
Ramasubbu, G., Kaup, A., & Herglotz, C. (2024). Modeling the Energy Consumption of the HEVC Software Encoding Process using Processor Events. In 2024 IEEE 26th International Workshop on Multimedia Signal Processing (MMSP). Purdue University, West Lafayette, Indiana, USA.
MLA:
Ramasubbu, Geetha, André Kaup, and Christian Herglotz. "Modeling the Energy Consumption of the HEVC Software Encoding Process using Processor Events." Proceedings of the 2024 IEEE 26th International Workshop on Multimedia Signal Processing (MMSP), Purdue University, West Lafayette, Indiana, USA 2024.
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