Terahertz Wave Scattering by Rough Surfaces including Higher Moments: Ray-Tracing Developments

Alissa M, Sheikh F, Zarifeh N, Kreul T, Kaiser T (2020)


Publication Type: Conference contribution

Publication year: 2020

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 14-16

Conference Proceedings Title: Proceedings of the 2020 IEEE International Conference on Computational Electromagnetics, ICCEM 2020

Event location: Singapore SG

ISBN: 9781728168234

DOI: 10.1109/ICCEM47450.2020.9219485

Abstract

The most common analytical model used in raytracing to estimate the scattered field by a random rough surface is the Kirchhoff approximation, where a normal distribution of the surface heights is assumed. When approximating the non-Gaussian surface roughness with a Gaussian distribution, the high peaks and valleys cause an overestimation of the heights' standard deviation and yields to inaccurate valuation of the coherent component of specular reflection. In this work, for an accurate scattering modeling of a non-line-of-sight (NLOS) propagation scenario, a curve fitting method is applied to calculate the effective roughness from non-Gaussian surfaces and then implemented in a self-programmed three-dimensional ray-tracer. When considering the third moments of the heights distribution, a deviation of (0 - 3.5) dB is observed in the scattering power depending on the material roughness.

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How to cite

APA:

Alissa, M., Sheikh, F., Zarifeh, N., Kreul, T., & Kaiser, T. (2020). Terahertz Wave Scattering by Rough Surfaces including Higher Moments: Ray-Tracing Developments. In Proceedings of the 2020 IEEE International Conference on Computational Electromagnetics, ICCEM 2020 (pp. 14-16). Singapore, SG: Institute of Electrical and Electronics Engineers Inc..

MLA:

Alissa, Mai, et al. "Terahertz Wave Scattering by Rough Surfaces including Higher Moments: Ray-Tracing Developments." Proceedings of the 6th IEEE International Conference on Computational Electromagnetics, ICCEM 2020, Singapore Institute of Electrical and Electronics Engineers Inc., 2020. 14-16.

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