Huber C, Heim C, Ermert H, Rupitsch SJ, Ullmann I, Vossiek M, Lyer S (2024)
Publication Type: Conference contribution
Publication year: 2024
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Conference Proceedings Title: 2024 IEEE International Symposium on Biomedical Imaging (ISBI)
ISBN: 979-8-3503-1333-8
DOI: 10.1109/ISBI56570.2024.10635132
Accurate models of biological structures are essential for medical training, calibrating equipment, and advancing research without animal experiments. In ultrasound, tissue mimicking phantoms, using materials like agarose or gelatin with added scatterers, are commonly used to simulate biological tissue. While the properties of these phantoms are integral for faithful ultrasound environments, their inner and outer structures are equally crucial. Modifying the outer structure is straightforward with outer molds, but altering the inner structure presents greater challenges. Introducing a tumor structure typically involved using either cylindrical or tethered spherical inclusions, both of which can introduce unwanted reflections. The incorporation of flow systems typically relies on removable rods, limiting complexity. Using 3D printed soluble filament, dissolved in multiple steps, helps to create nearly arbitrary inner structures with different tissue mimicking materials. In this study, the process of generating such complex ultrasound phantoms is described and evaluated with ultrasound measurements.
APA:
Huber, C., Heim, C., Ermert, H., Rupitsch, S.J., Ullmann, I., Vossiek, M., & Lyer, S. (2024). Ultrasound Phantom of a Carotid Bifurcation Tumor Using Multiple 3D Printed Soluble Filaments. In 2024 IEEE International Symposium on Biomedical Imaging (ISBI). Athen, GR: Institute of Electrical and Electronics Engineers, Inc..
MLA:
Huber, Christian, et al. "Ultrasound Phantom of a Carotid Bifurcation Tumor Using Multiple 3D Printed Soluble Filaments." Proceedings of the IEEE International Symposium on Biomedical Imaging - ISBI 2024, Athen Institute of Electrical and Electronics Engineers, Inc., 2024.
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