The Contribution of International Students in Smart Cities Through Open Innovation
Wang W, Sengewald T (2024)
Publication Type: Conference contribution, Conference Contribution
Publication year: 2024
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2024 Smart Cities Symposium Prague, SCSP 2024 - Proceedings
Event location: Prague
ISBN: 9798350360950
DOI: 10.1109/SCSP61506.2024.10552732
Abstract
The concept of the smart city has been an ongoing trend over the past two decades. Smart cities encourage citizen participation through innovative approaches to enhance urban resilience and sustainability. As a distinct aspect of the citizenship of a city, the contribution of international students to the smart city concept has not received enough attention. In this research, a qualitative study was conducted, involving 12 in-depth semi-structured interviews with international students across three different academic levels to investigate how the contribution to smart city innovation of international students can be enhanced. This study delves into the motivations, approaches, and potential barriers to their participation. The findings reveal that their involvement is mainly driven by addressing real-life problems and seeking recognition. An integrated approach through online platforms with in-person interactions could be helpful. However, to include them in the innovation process of smart cities, we must consider the unique difficulties they face.
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APA:
Wang, W., & Sengewald, T. (2024). The Contribution of International Students in Smart Cities Through Open Innovation. In Jiri Ruzicka (Eds.), 2024 Smart Cities Symposium Prague, SCSP 2024 - Proceedings. Prague, CZ: Institute of Electrical and Electronics Engineers Inc..
MLA:
Wang, Wenwen, and Timon Sengewald. "The Contribution of International Students in Smart Cities Through Open Innovation." Proceedings of the 2024 Smart Cities Symposium Prague, SCSP 2024, Prague Ed. Jiri Ruzicka, Institute of Electrical and Electronics Engineers Inc., 2024.
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