Becker T (2023)
Publication Status: Published
Publication Type: Conference contribution, Conference Contribution
Publication year: 2023
Publisher: Mesago PCIM GmbH
Pages Range: 1512-1516
ISBN: 9783800760916
DOI: 10.30420/566091210
APA:
Becker, T. (2023). Improved Power Cycling Reliability through the use of SmartSiC ™ Engineered Substrate for Power Devices. In Proceedings of the 2023 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2023 (pp. 1512-1516). Mesago PCIM GmbH.
MLA:
Becker, Tom. "Improved Power Cycling Reliability through the use of SmartSiC ™ Engineered Substrate for Power Devices." Proceedings of the 2023 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2023 Mesago PCIM GmbH, 2023. 1512-1516.
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