Walter D, Brand M, Heidorn C, Witterauf M, Hannig F, Teich J (2024)
Publication Type: Conference contribution, Conference Contribution
Publication year: 2024
Conference Proceedings Title: Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS)
URI: https://ieeexplore.ieee.org/document/10558549
DOI: 10.1109/ISCAS58744.2024.10558549
APA:
Walter, D., Brand, M., Heidorn, C., Witterauf, M., Hannig, F., & Teich, J. (2024). ALPACA: An Accelerator Chip for Nested Loop Programs. In Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS). Singapore, SG.
MLA:
Walter, Dominik, et al. "ALPACA: An Accelerator Chip for Nested Loop Programs." Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), Singapore 2024.
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