Hardware Design Challenges and Modulation Schemes in Joint Communication and Sensing

Faghih-Naini S, Sebastian C, Reißland T, Weigel R, Scheiner B (2024)

Publication Language: English

Publication Status: Published

Publication Type: Journal article, Review article

Future Publication Type: Journal article

Publication year: 2024

Journal

IEEE Microwave Magazine Institute of Electrical and Electronics Engineers (IEEE)

DOI: 10.1109/MMM.2023.3341010

Authors with CRIS profile

Samira Faghih-Naini Lehrstuhl für Technische Elektronik (LTE) Caroline Sebastian Lehrstuhl für Technische Elektronik (LTE) Torsten Reißland Lehrstuhl für Intelligente Technische Elektronik und Systeme Robert Weigel Lehrstuhl für Technische Elektronik (LTE) Benedict Scheiner Lehrstuhl für Technische Elektronik (LTE)

Additional Organisation(s)

FAU Profilzentrum Licht.Materie.Quantentechnologien (FAU LMQ)

How to cite

APA:

Faghih-Naini, S., Sebastian, C., Reißland, T., Weigel, R., & Scheiner, B. (2024). Hardware Design Challenges and Modulation Schemes in Joint Communication and Sensing. IEEE Microwave Magazine. https://doi.org/10.1109/MMM.2023.3341010

MLA:

Faghih-Naini, Samira, et al. "Hardware Design Challenges and Modulation Schemes in Joint Communication and Sensing." IEEE Microwave Magazine (2024).

BibTeX: Download