Fabrication of TiO2@Cu mesh with impressive hydrophobic surface for electromagnetic interference shielding
Yuan Y, He Y, Shi S, Wu D, Yang G (2023)
Publication Type: Journal article
Publication year: 2023
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Abstract
This study investigates the surface modification of copper mesh using modified TiO2 coatings to enhance its surface hydrophobic properties while preserving electromagnetic interference (EMI) shielding effectiveness. Silicon coupling agent treated TiO2 particles were employed to create micro/nanostructured superhydrophobic coatings. The deposition times was found to influence the coating distribution, pore filling, and surface hydrophobicity. S-TiO2@Cu mesh with single layer of modified TiO2 coating exhibited the highest water contact angle compared with T-TiO2@Cu mesh with triple layer coatings and original O-TiO2@Cu mesh. Superior self-cleaning performance and robust wear resistance of the hydrophobic coatings for S-TiO2@Cu mesh are revealed. In addition, both S -TiO2@Cu mesh and T-TiO2@Cu mesh exhibited satisfactory EMI shielding efficiency without compromising the intrinsic properties of the copper mesh. These findings provide practical insights into surface modification of copper mesh substrate, emphasizing the balance between surface properties and EMI shielding. The hydrophobic coatings hold promise for multifunctional applications, offering enhanced surface properties without compromising EMI shielding performance.
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APA:
Yuan, Y., He, Y., Shi, S., Wu, D., & Yang, G. (2023). Fabrication of TiO2@Cu mesh with impressive hydrophobic surface for electromagnetic interference shielding. Surface Innovations. https://dx.doi.org/10.1680/jsuin.23.00067
MLA:
Yuan, Yongchao, et al. "Fabrication of TiO2@Cu mesh with impressive hydrophobic surface for electromagnetic interference shielding." Surface Innovations (2023).
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