Micro Replication

Distler T, Eischer M, Lawniczak L (2023)


Publication Language: English

Publication Type: Conference contribution

Publication year: 2023

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 123-137

Conference Proceedings Title: Proceedings of the 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN '23)

Event location: Porto, Portugal

ISBN: 9798350347937

DOI: 10.1109/DSN58367.2023.00024

Abstract

State-machine replication protocols represent the foundation of many fault-tolerant services. Unfortunately, their inherent complexity makes existing implementations notoriously difficult to debug and test. To address this problem, we propose a novel design approach, micro replication, whose main goal is to reduce bugs and enable replication protocols with improved debuggability properties. At its core, our concept consists of a set of principles that, if followed during protocol design, later significantly facilitate crucial tasks such as bug-source isolation, state-information retrieval, as well as root-cause identification. To achieve this, micro replication organizes a protocol as a composition of specialized modules ('micro replicas') that each encapsulate a particular protocol phase or mechanism, and therefore are easier to test and monitor than traditional monolithic replicas. Besides discussing the underlying ideas of our approach, to show its feasibility we also present and evaluate Mirador, the first micro-replicated Byzantine fault-tolerant protocol.

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APA:

Distler, T., Eischer, M., & Lawniczak, L. (2023). Micro Replication. In Proceedings of the 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN '23) (pp. 123-137). Porto, Portugal: Institute of Electrical and Electronics Engineers Inc..

MLA:

Distler, Tobias, Michael Eischer, and Laura Lawniczak. "Micro Replication." Proceedings of the 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN '23), Porto, Portugal Institute of Electrical and Electronics Engineers Inc., 2023. 123-137.

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