Hexagonal Hybrid Bismuthene by Molecular Interface Engineering

Dolle C, Oestreicher V, Ruiz AM, Kohring M, Garnes-Portolés F, Wu M, Sánchez-Santolino G, Seijas-Da Silva A, Alcaraz M, Eggeler YM, Spiecker E, Canet-Ferrer J, Leyva-Perez A, Weber HB, Varela M, Baldoví JJ, Abellán G (2023)

Publication Type: Journal article

Publication year: 2023


Book Volume: 145

Pages Range: 12487–12498

Journal Issue: 23

DOI: 10.1021/jacs.2c13036


High-quality devices based on layered heterostructures are typically built from materials obtained by complex solid-state physical approaches or laborious mechanical exfoliation and transfer. Meanwhile, wet-chemically synthesized materials commonly suffer from surface residuals and intrinsic defects. Here, we synthesize using an unprecedented colloidal photocatalyzed, one-pot redox reaction a few-layers bismuth hybrid of “electronic grade” structural quality. Intriguingly, the material presents a sulfur-alkyl-functionalized reconstructed surface that prevents it from oxidation and leads to a tuned electronic structure that results from the altered arrangement of the surface. The metallic behavior of the hybrid is supported by ab initio predictions and room temperature transport measurements of individual nanoflakes. Our findings indicate how surface reconstructions in two-dimensional (2D) systems can promote unexpected properties that can pave the way to new functionalities and devices. Moreover, this scalable synthetic process opens new avenues for applications in plasmonics or electronic (and spintronic) device fabrication. Beyond electronics, this 2D hybrid material may be of interest in organic catalysis, biomedicine, or energy storage and conversion.

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Dolle, C., Oestreicher, V., Ruiz, A.M., Kohring, M., Garnes-Portolés, F., Wu, M.,... Abellán, G. (2023). Hexagonal Hybrid Bismuthene by Molecular Interface Engineering. Journal of the American Chemical Society, 145(23), 12487–12498. https://doi.org/10.1021/jacs.2c13036


Dolle, Christian, et al. "Hexagonal Hybrid Bismuthene by Molecular Interface Engineering." Journal of the American Chemical Society 145.23 (2023): 12487–12498.

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