Lithiumniobate die assembled by a low-stress soldering technique method to fasten a surface acoustic wave sensor
Ribes-Pleguezuelo P, Frei K, Bruckner G, Beckert E, Eberhardt R, Tünnermann A (2017)
Publication Type: Conference contribution
Publication year: 2017
Publisher: SciTePress
Book Volume: 2017-January
Pages Range: 91-97
Conference Proceedings Title: PHOTOPTICS 2018 - Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology
Event location: Funchal, Madeira, PRT
ISBN: 9789897582868
Abstract
Solderjet bumping technique was applied to assemble a Surface Acoustic Wave (SAW) sensor prototype designed with a lithiumniobate crystal and a base sub-mount made of stainless steel. The assembly was designed with this technology in order to withstand the device’s mechanical strength requirements. The initial performed tests showed that the solderjet bumping technique can be used to assemble brittle components without creating internal damage in the crystal. The selected solder alloy Au80Sn20 used to fasten the lithiumniobate showed proper alloy wettability and joint strength on the crystal and on the substrate material. Finally, a lithiumniobate die device was soldered by soldering means to the stainless steel sub-mount, and withstood the strength device requirements by passing robustness (push) tests.
Involved external institutions
Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering
Germany (DE)
Carinthian Tech Research (CTR)
Austria (AT)
Germany (DE)
Carinthian Tech Research (CTR)
Austria (AT)
How to cite
APA:
Ribes-Pleguezuelo, P., Frei, K., Bruckner, G., Beckert, E., Eberhardt, R., & Tünnermann, A. (2017). Lithiumniobate die assembled by a low-stress soldering technique method to fasten a surface acoustic wave sensor. In Maria Raposo, Paulo A. Ribeiro (Eds.), PHOTOPTICS 2018 - Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology (pp. 91-97). Funchal, Madeira, PRT: SciTePress.
MLA:
Ribes-Pleguezuelo, Pol, et al. "Lithiumniobate die assembled by a low-stress soldering technique method to fasten a surface acoustic wave sensor." Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology, PHOTOPTICS 2018, Funchal, Madeira, PRT Ed. Maria Raposo, Paulo A. Ribeiro, SciTePress, 2017. 91-97.
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