Laying the foundations of ultrafast stealth dicing of silicon with picosecond laser pulses at 2-m wavelength
Blothe M, Chambonneau M, Heuermann T, Gebhardt M, Limpert J, Nolte S (2021)
Publication Type: Conference contribution
Publication year: 2021
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2021
Event location: Munich, DEU
ISBN: 9781665418768
DOI: 10.1109/CLEO/Europe-EQEC52157.2021.9542700
Abstract
Numerous applications are enabled by the possibility to modify transparent materials in the bulk with ultrashort laser pulses. In glasses the inscription of waveguides and nanogratings, welding and dicing processes are finding their way into the industrial world. The transfer of these established processes to narrow band-gap materials is subject of current research activities. Here, silicon as the current most important semiconductor material is of particular interest.
Involved external institutions
Germany (DE)How to cite
APA:
Blothe, M., Chambonneau, M., Heuermann, T., Gebhardt, M., Limpert, J., & Nolte, S. (2021). Laying the foundations of ultrafast stealth dicing of silicon with picosecond laser pulses at 2-m wavelength. In 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2021. Munich, DEU: Institute of Electrical and Electronics Engineers Inc..
MLA:
Blothe, Markus, et al. "Laying the foundations of ultrafast stealth dicing of silicon with picosecond laser pulses at 2-m wavelength." Proceedings of the 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2021, Munich, DEU Institute of Electrical and Electronics Engineers Inc., 2021.
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