Mechanistic Insight into Solution-Based Atomic Layer Deposition of CuSCN Provided by In Situ and Ex Situ Methods

Hilpert F, Liao PC, Franz E, Koch V, Fromm L, Topraksal E, Görling A, Smith AS, Barr M, Bachmann J, Brummel O, Libuda J (2023)


Publication Type: Journal article

Publication year: 2023

Journal

Pages Range: 19536–19544

DOI: 10.1021/acsami.2c16943

Abstract

Solution-based atomic layer deposition (sALD) processes enable the preparation of thin films on nanostructured surfaces while controlling the film thickness down to a monolayer and preserving the homogeneity of the film. In sALD, a similar operation principle as in gas-phase ALD is used, however, with a broader range of accessible materials and without requiring expensive vacuum equipment. In this work, a sALD process was developed to prepare CuSCN on a Si substrate using the precursors CuOAc and LiSCN. The film growth was studied by ex situ atomic force microscopy (AFM), analyzed by a neural network (NN) approach, ellipsometry, and a newly developed in situ infrared (IR) spectroscopy experiment in combination with density functional theory (DFT). In the self-limiting sALD process, CuSCN grows on top of an initially formed two-dimensional (2D) layer as three-dimensional spherical nanoparticles with an average size of ∼25 nm and a narrow particle size distribution. With increasing cycle number, the particle density increases and larger particles form via Ostwald ripening and coalescence. The film grows preferentially in the β-CuSCN phase. Additionally, a small fraction of the α-CuSCN phase and defect sites form.

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How to cite

APA:

Hilpert, F., Liao, P.-C., Franz, E., Koch, V., Fromm, L., Topraksal, E.,... Libuda, J. (2023). Mechanistic Insight into Solution-Based Atomic Layer Deposition of CuSCN Provided by In Situ and Ex Situ Methods. ACS Applied Materials and Interfaces, 19536–19544. https://dx.doi.org/10.1021/acsami.2c16943

MLA:

Hilpert, Felix, et al. "Mechanistic Insight into Solution-Based Atomic Layer Deposition of CuSCN Provided by In Situ and Ex Situ Methods." ACS Applied Materials and Interfaces (2023): 19536–19544.

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