Thermoelectric Properties Investigation of Single nanowires by utilizing a Thermoelectric Nanowire Characterization Platform

Wang Z, Ruhhammer J, Adhikari S, Rostek R, Moser D, Paul O, Kojda D, Mitdank R, Fischer SF, Toellner W, Nielsch K, Kroener M, Woias P (2013)

Publication Type: Conference contribution

Publication year: 2013

Pages Range: 738-741

Conference Proceedings Title: 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

Event location: CHN

ISBN: 9781467363525

DOI: 10.1109/NEMS.2013.6559834

Abstract

We demonstrate the design and fabrication of a novel micromachined Thermoelectric Nanowire Characterization Platform (TNCP) which is utilized to characterize the thermoelectric properties of various nanowires. Single nanowire is assembled onto the pre-fabricated TNCP by means of dielectrophoresis (DEP) in combination with a water droplet evaporation scheme. After assembly, a reliable ohmic contact is generated between the bismuth telluride (Bi 2Te3) nanowire and the underlying electrodes by means of scanning electron microscope (SEM) focused electron beam-induced deposition (EBID). Finally, the electrical conductivity and Seebeck coefficient of Silver (Ag) and Bi2Te3 nanowires are investigated and presented in this paper. © 2013 IEEE.

Involved external institutions

Albert-Ludwigs-Universität Freiburg DE Germany (DE) Humboldt-Universität zu Berlin DE Germany (DE) Universität Hamburg (UHH) DE Germany (DE)

How to cite

APA:

Wang, Z., Ruhhammer, J., Adhikari, S., Rostek, R., Moser, D., Paul, O.,... Woias, P. (2013). Thermoelectric Properties Investigation of Single nanowires by utilizing a Thermoelectric Nanowire Characterization Platform. In 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 (pp. 738-741). CHN.

MLA:

Wang, Zhi, et al. "Thermoelectric Properties Investigation of Single nanowires by utilizing a Thermoelectric Nanowire Characterization Platform." Proceedings of the 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, CHN 2013. 738-741.

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