Mechanical reinforcement of copper films with ceramic nanoparticles

Leifert A, Mohamed-Noriega N, Meier A, Mondin G, Dörfler S, Grothe J, Kaskel S, Schumm B, Nowka C, Hampel S, Cuéllar EL (2014)

Publication Type: Conference contribution

Publication year: 2014

Journal

Ceramic Engineering and Science Proceedings American Ceramic Society

Publisher: American Ceramic Society

Book Volume: 35

Pages Range: 361-366

Conference Proceedings Title: Ceramic Engineering and Science Proceedings

Event location: Daytona Beach, FL, USA

ISBN: 9781119040439

Abstract

Metal matrix nanocomposites are promising materials for applications in aerospace, automotive and electronic industries due to their excellent mechanical and physical properties. Here, a new synthesis route is developed for the preparation of ceramic particulate reinforced metal films. The homogeneous distribution of different ceramic nanoparticles (TiO2, TiC and SiC) in the range of 5-10 wt.% into copper films by a wet chemical approach results in metal matrix composites with metallic electrical conductivity and enhanced hardness and wear resistance. Reinforcing material and concentration thereof can be easily varied owing to the polymer precursor memod that is established. Electrical conductivity is marginally impaired compared to pure copper films, but still in the range of metallic conductivity. Hardness is analyzed by nanoindentation of the films. Highest hardness is found for 10 wt.% TiO2 in copper (Hit = 1-39 GPa). Improved wear and scratch resistance are shown by a pencil hardness scratch test (Wolff-Wilborn, ISO 15 184).

Involved external institutions

Technische Universität Dresden DE Germany (DE) Fraunhofer-Institut für Werkstoff- und Strahltechnik (IWS) / Fraunhofer Institute for Material and Beam Technology DE Germany (DE) Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden e.V. (IFW) / Leibniz Institute for Solid State and Materials Research Dresden DE Germany (DE) Universidad Autónoma de Nuevo León MX Mexico (MX)

How to cite

APA:

Leifert, A., Mohamed-Noriega, N., Meier, A., Mondin, G., Dörfler, S., Grothe, J.,... Cuéllar, E.L. (2014). Mechanical reinforcement of copper films with ceramic nanoparticles. In Charles Lewinsohn, Yanchun Zhou, Jingyang Wang, Waltraud M. Kriven, Kyoung Il Moon, Taejin Hwang, Dongming Zhu (Eds.), Ceramic Engineering and Science Proceedings (pp. 361-366). Daytona Beach, FL, USA: American Ceramic Society.

MLA:

Leifert, Annika, et al. "Mechanical reinforcement of copper films with ceramic nanoparticles." Proceedings of the Developments in Strategic Materials and Computational Design V - 38th International Conference on Advanced Ceramics and Composites, ICACC 2014, Daytona Beach, FL, USA Ed. Charles Lewinsohn, Yanchun Zhou, Jingyang Wang, Waltraud M. Kriven, Kyoung Il Moon, Taejin Hwang, Dongming Zhu, American Ceramic Society, 2014. 361-366.

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