Simulated Annealing for 3D Shape Correspondence
Holzschuh B, Laehner Z, Cremers D (2020)
Publication Type: Conference contribution
Publication year: 2020
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 252-260
Conference Proceedings Title: Proceedings - 2020 International Conference on 3D Vision, 3DV 2020
Event location: Virtual, Fukuoka, JPN
ISBN: 9781728181288
DOI: 10.1109/3DV50981.2020.00035
Abstract
We propose to use Simulated Annealing to solve the correspondence problem between near-isometric 3D shapes. Our method gains efficiency through quickly upsampling a sparse correspondence by minimizing the embedding error of new samples on the surfaces and applying simulated annealing to refine the result. The algorithm alternates between sampling additional points on the surface and swapping points within the current solution according to Simulated Annealing theory. Simulated Annealing is a probabilistic method and less prone to get stuck in local extrema which allows us to obtain good results on the NPhard quadratic assignment problem} (QAP). Our method can be used as a stand-alone correspondence pipeline through an initial seed generator as well as to densify a set of sparse input matches. Furthermore, the use of locality sensitive hashing to approximate geodesic distances reduces the computational complexity and memory consumption significantly. This allows our algorithm to run on meshes with over 100k points, an accomplishment that few approaches tackling the QAP directly achieve. We show convincing results on datasets like TOSCA and SHREC'19 Connecitvity.
Involved external institutions
Germany (DE)How to cite
APA:
Holzschuh, B., Laehner, Z., & Cremers, D. (2020). Simulated Annealing for 3D Shape Correspondence. In Proceedings - 2020 International Conference on 3D Vision, 3DV 2020 (pp. 252-260). Virtual, Fukuoka, JPN: Institute of Electrical and Electronics Engineers Inc..
MLA:
Holzschuh, Benjamin, Zorah Laehner, and Daniel Cremers. "Simulated Annealing for 3D Shape Correspondence." Proceedings of the 8th International Conference on 3D Vision, 3DV 2020, Virtual, Fukuoka, JPN Institute of Electrical and Electronics Engineers Inc., 2020. 252-260.
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