A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology
Amend P, Pscherer C, Rechtenwald T, Frick T, Schmidt M (2010)
Publication Type: Conference contribution
Publication year: 2010
Journal
Publisher: Elsevier B.V.
Book Volume: 5
Pages Range: 561-572
Conference Proceedings Title: Physics Procedia
DOI: 10.1016/j.phpro.2010.08.084
Abstract
This paper presents experimental results of manufacturing MID-prototypes by means of SLS, laser structuring and metallization. Therefore common SLS powder (PA12) doped with laser structuring additives is used. First of all the influence of the additives on the characteristic temperatures of melting and crystallization is analyzed by means of DSC. Afterwards the sintering process is carried out and optimized by experiments. Finally the generated components are qualified regarding their density, mechanical properties and surface roughness. Especially the surface quality is important for the metallization process. Therefore surface finishing techniques are investigated. © 2010 Published by Elsevier B.V.
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Germany (DE)How to cite
APA:
Amend, P., Pscherer, C., Rechtenwald, T., Frick, T., & Schmidt, M. (2010). A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology. In Physics Procedia (pp. 561-572). Elsevier B.V..
MLA:
Amend, P., et al. "A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology." Proceedings of the Physics Procedia Elsevier B.V., 2010. 561-572.
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