Schrauder J, Ermer J, Maier A, Frick T, Kaufmann F, Müller M, Schmidt M, Roth S (2022)
Publication Type: Journal article
Publication year: 2022
Original Authors: Julian Schrauder, Jakob Ermer, Andreas Maier, Thomas Frick, Florian Kaufmann, Markus Müller, Stephan Roth, Michael Schmidt
Book Volume: 111
Pages Range: 758-761
DOI: 10.1016/j.procir.2022.08.120
The demand for semiconductors and microelectronic components is greater than ever and will continuously rise in the future due to increasing automation and digitalization. Also, there is a growing need for robust, high-temperature resistant electrical connections which are essential for the circuit function. Previous investigations have shown that laser-based droplet brazing can create high temperature stable joints e.g. on thin silver layers, without applying an external force on the micro-component to be joined. In order to expand the application field of this process, further combinations of different brazing and substrate materials are investigated. In this paper the influence of additionally induced thermal energy at the diffusion zone was analyzed via shear tests. The studies show, that using brazing alloy CuSn11 in combination with a substrate heating provides the most robust joints on the tested substrate material.
APA:
Schrauder, J., Ermer, J., Maier, A., Frick, T., Kaufmann, F., Müller, M.,... Roth, S. (2022). Laser-based droplet brazing – Influence of additionally induced thermal energy on joint quality. Procedia CIRP, 111, 758-761. https://doi.org/10.1016/j.procir.2022.08.120
MLA:
Schrauder, Julian, et al. "Laser-based droplet brazing – Influence of additionally induced thermal energy on joint quality." Procedia CIRP 111 (2022): 758-761.
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