Design and Analysis of a RF Front-End Receiver System Based on Multi-Layer Organic Filtering for Sub-6 GHz Mobile Communication Applications
Schuster A, Erhardt S, Reißland T, Weigel R (2023)
Publication Status: Published
Publication Type: Conference contribution, Conference Contribution
Future Publication Type: Conference contribution
Publication year: 2023
Publisher: IEEE Computer Society
Book Volume: 2023-January
Pages Range: 111-114
Conference Proceedings Title: IEEE Radio and Wireless Symposium, RWS
Event location: Las Vegas, Nevada, USA
ISBN: 9781665493444
URI: https://ieeexplore.ieee.org/document/10046331
DOI: 10.1109/RWS55624.2023.10046331
Abstract
This paper describes a front-end architecture for an all-band direct sampling receiver. To evaluate the characteristics of this front-end, we conducted a S-parameter analysis to evaluate the performance of transmission and isolation of individual transmission channels. Our results prove high mutual isolation of the channels filtered by Multi-Layer Organic (MLO) filters. The effect of individual filter techniques is compared. Furthermore, the frequency planning is described. Finally, the usability of this front-end within a mobile network is discussed.
Authors with CRIS profile
Armin Schuster
Lehrstuhl für Technische Elektronik (LTE)
Stefan Erhardt
Lehrstuhl für Technische Elektronik (LTE)
Torsten Reißland
Lehrstuhl für Technische Elektronik (LTE)
Robert Weigel
Lehrstuhl für Technische Elektronik (LTE)
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How to cite
APA:
Schuster, A., Erhardt, S., Reißland, T., & Weigel, R. (2023). Design and Analysis of a RF Front-End Receiver System Based on Multi-Layer Organic Filtering for Sub-6 GHz Mobile Communication Applications. In IEEE Radio and Wireless Symposium, RWS (pp. 111-114). Las Vegas, Nevada, USA, US: IEEE Computer Society.
MLA:
Schuster, Armin, et al. "Design and Analysis of a RF Front-End Receiver System Based on Multi-Layer Organic Filtering for Sub-6 GHz Mobile Communication Applications." Proceedings of the 2023 IEEE Radio and Wireless Symposium, Las Vegas, Nevada, USA IEEE Computer Society, 2023. 111-114.
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