Deumel S, Reg Y, Huerdler JE, Hussenether L, Schmidt O, Barabash A, Heiß W, Tedde SF (2022)
Publication Type: Journal article
Publication year: 2022
To realize various applications, structuring methods of metal-halide perovskites are of great importance. Most of the common techniques have focused on thin layers and suffer from limitations for thick layers. But thicknesses of several hundred micrometers are necessary, especially for the application field of medical X-ray detection. In order to scale perovskite-based X-ray detectors from small laboratory devices to realistic product sizes, new manufacturing strategies such as laser cutting are necessary. Here the potential of structuring any configurable geometry out of thick, freestanding methylammonium lead iodide (MAPbI
APA:
Deumel, S., Reg, Y., Huerdler, J.E., Hussenether, L., Schmidt, O., Barabash, A.,... Tedde, S.F. (2022). Laser Cutting of Metal-Halide-Perovskite Wafers for X-Ray Detector Integration. Advanced Materials Interfaces. https://doi.org/10.1002/admi.202200642
MLA:
Deumel, Sarah, et al. "Laser Cutting of Metal-Halide-Perovskite Wafers for X-Ray Detector Integration." Advanced Materials Interfaces (2022).
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