Laser Cutting of Metal-Halide-Perovskite Wafers for X-Ray Detector Integration

Deumel S, Reg Y, Huerdler JE, Hussenether L, Schmidt O, Barabash A, Heiß W, Tedde SF (2022)

Publication Type: Journal article

Publication year: 2022

Journal

Advanced Materials Interfaces WILEY-VCH Verlag GmbH & Co. KGaA

DOI: 10.1002/admi.202200642

Abstract

To realize various applications, structuring methods of metal-halide perovskites are of great importance. Most of the common techniques have focused on thin layers and suffer from limitations for thick layers. But thicknesses of several hundred micrometers are necessary, especially for the application field of medical X-ray detection. In order to scale perovskite-based X-ray detectors from small laboratory devices to realistic product sizes, new manufacturing strategies such as laser cutting are necessary. Here the potential of structuring any configurable geometry out of thick, freestanding methylammonium lead iodide (MAPbI3) wafers with ultrashort pulse (USP) laser at a wavelength of 1064 nm, is shown. A small difference in the laser parameters causes a significant variation of the perovskite from material decomposition to almost no effects. With the chosen parameter set of the USP laser, the MAPbI3 wafer can be shaped so that just slight changes in the morphology and no difference in the X-ray performance can be seen. This method offers the possibility of scaling up perovskite X-ray detectors in the future without significant signal loss.

Authors with CRIS profile

Anastasia Barabash Institute Materials for Electronics and Energy Technology (i-MEET) Wolfgang Heiß Professur für Werkstoffwissenschaften (lösungsprozessierte Halbleitermaterialien)

Additional Organisation(s)

Graduiertenkolleg 2495/2 Energiekonvertierungssysteme: von Materialien zu Bauteilen (Energy Conversion Systems: From Materials to Devices)

Involved external institutions

Siemens Healthineers DE Germany (DE) Bayerisches Laserzentrum gemeinnützige Forschungsgesellschaft mbH (BLZ) DE Germany (DE)

How to cite

APA:

Deumel, S., Reg, Y., Huerdler, J.E., Hussenether, L., Schmidt, O., Barabash, A.,... Tedde, S.F. (2022). Laser Cutting of Metal-Halide-Perovskite Wafers for X-Ray Detector Integration. Advanced Materials Interfaces. https://doi.org/10.1002/admi.202200642

MLA:

Deumel, Sarah, et al. "Laser Cutting of Metal-Halide-Perovskite Wafers for X-Ray Detector Integration." Advanced Materials Interfaces (2022).

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