Active Damping of Thin Film Shape Memory Alloy Devices

Ahmadi S, Jacob K, Wendler F, Padhy A, Kohl M (2021)

Publication Type: Journal article

Publication year: 2021

Journal

Proceedings in Applied Mathematics and Mechanics Gesellschaft für Angewandte Mathematik und Mechanik (GAMM)

Book Volume: 20

Issue: 1

DOI: 10.1002/pamm.202000310

Abstract

The thermomechanical coupling in shape memory alloys (SMAs) provides an effective mechanism of vibration damping by a cyclic structural phase transition. Here, we present simulations for an active SMA damper device based on a polycrystalline film materials, in which active damping via the one-way shape memory effect is exploited. We apply an extension of a previously reported superelastic model, that combines transition state kinetics with a phase field approach for the case of shock loading. By this approach, we are able to describe the time-resolved active damping performance of the device in agreement with experimental results.

Authors with CRIS profile

Frank Wendler Lehrstuhl für Werkstoffsimulation Asutosh Padhy Lehrstuhl für Werkstoffsimulation

Additional Organisation(s)

Lehrstuhl für Werkstoffsimulation

Involved external institutions

Karlsruhe Institute of Technology (KIT) DE Germany (DE)

How to cite

APA:

Ahmadi, S., Jacob, K., Wendler, F., Padhy, A., & Kohl, M. (2021). Active Damping of Thin Film Shape Memory Alloy Devices. Proceedings in Applied Mathematics and Mechanics, 20. https://doi.org/10.1002/pamm.202000310

MLA:

Ahmadi, Shahabeddin, et al. "Active Damping of Thin Film Shape Memory Alloy Devices." Proceedings in Applied Mathematics and Mechanics 20 (2021).

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