Linking through-thickness cracks in metallic thin films to in-situ electrical resistance peak broadening
Gebhart DD, Krapf A, Gammer C, Merle B, Cordill MJ (2022)
Publication Type: Journal article
Publication year: 2022
Journal
Book Volume: 212
Article Number: 114550
DOI: 10.1016/j.scriptamat.2022.114550
Abstract
Measurements of electrical resistance have been used extensively as a failure criterion in cyclically loaded conductive films. However, not much research has been performed on extracting additional information contained within such resistance data sets. This study shows that an increase in peak width evidences a transition from cracks bridging to through-thickness crack formation. A Au/Cr bilayer system on a polyimide substrate is used for data generation but the method is applicable to any material system where both necking and through-thickness cracks are formed and no immediate formation of electrically insulating oxide layers occurs upon damage initiation. The method is easy to implement, and has the ability to replace time-intensive and destructive inspection methods.
Authors with CRIS profile
Anna Krapf
Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)
Benoit Merle
Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)
Involved external institutions
Austria (AT)How to cite
APA:
Gebhart, D.D., Krapf, A., Gammer, C., Merle, B., & Cordill, M.J. (2022). Linking through-thickness cracks in metallic thin films to in-situ electrical resistance peak broadening. Scripta Materialia, 212. https://doi.org/10.1016/j.scriptamat.2022.114550
MLA:
Gebhart, David D., et al. "Linking through-thickness cracks in metallic thin films to in-situ electrical resistance peak broadening." Scripta Materialia 212 (2022).
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