Liebig JP, Mackovic M, Spiecker E, Göken M, Merle B (2021)
Publication Type: Journal article, Original article
Publication year: 2021
Book Volume: 215
Article Number: 117079
DOI: 10.1016/j.actamat.2021.117079
The limited ductility of metallic thin films (< 1%) poses a challenge to MEMS and flexible electronics applications. Here, we report on freestanding gold specimens with the remarkable ability to accommodate ≥10% plastic deformation while retaining a high strength. Using in situ nanomechanical testing in a transmission electron microscope, this exceptionally high ductility is traced back to the combination of an ultrathin thickness, a columnar microstructure and a (111) fiber texture. Under such conditions, the deformation is largely mediated by grain boundaries through grain boundary sliding and shear coupled grain boundary migration. Because these non-conventional mechanisms preserve the cross-sectional thickness of the specimens, necking is postponed and the samples can reach a high ductility. Since the mechanisms were evidenced at room temperature and under strain-rate conditions typical of most applications, the findings open up promising outlooks for developing ductile metallic films by microstructural engineering.
APA:
Liebig, J.P., Mackovic, M., Spiecker, E., Göken, M., & Merle, B. (2021). Grain boundary mediated plasticity: A blessing for the ductility of metallic thin films? Acta Materialia, 215. https://doi.org/10.1016/j.actamat.2021.117079
MLA:
Liebig, Jan Philipp, et al. "Grain boundary mediated plasticity: A blessing for the ductility of metallic thin films?" Acta Materialia 215 (2021).
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