The 2021 flexible and printed electronics roadmap

Bonnassieux Y, Brabec C, Cao Y, Carmichael TB, Chabinyc ML, Cheng KT, Cho G, Chung A, Cobb CL, Distler A, Egelhaaf HJ, Grau G, Guo X, Haghiashtiani G, Huang TC, Hussain MM, Iniguez B, Lee TM, Li L, Ma Y, Ma D, McAlpine MC, Ng TN, Österbacka R, Patel SN, Peng J, Peng H, Rivnay J, Shao L, Steingart D, Street RA, Subramanian V, Torsi L, Wu Y (2021)


Publication Type: Journal article, Review article

Publication year: 2021

Journal

Book Volume: 6

Article Number: 023001

Journal Issue: 2

DOI: 10.1088/2058-8585/abf986

Abstract

This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

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How to cite

APA:

Bonnassieux, Y., Brabec, C., Cao, Y., Carmichael, T.B., Chabinyc, M.L., Cheng, K.T.,... Wu, Y. (2021). The 2021 flexible and printed electronics roadmap. Flexible and Printed Electronics, 6(2). https://doi.org/10.1088/2058-8585/abf986

MLA:

Bonnassieux, Yvan, et al. "The 2021 flexible and printed electronics roadmap." Flexible and Printed Electronics 6.2 (2021).

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