Design and Fabrication of a Multi-Material Neurosurgical Simulator for an Endoscopic Third Ventriculostomy
Riedle H, Wittmann P, Franke J, Rössler K (2019)
Publication Type: Conference contribution
Publication year: 2019
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: BMEiCON 2019 - 12th Biomedical Engineering International Conference
Event location: Ubon Ratchathani, THA
ISBN: 9781728137520
DOI: 10.1109/BMEiCON47515.2019.8990334
Abstract
Haptic surgical simulators can improve skills and knowledge through experience. One possible application is the training of the high-risk procedure of an endoscopic third ventriculostomy (ETV) to treat an occlusive hydrocephalus. This study presents the development of a neurosurgical simulator optimized for automated manufacturing, while maintaining anatomical details and a variety of material properties. The core of the simulator is a 3D printed silicone model of the ventricular system, embedded in soft silicone gel, simulating the brain matter. Hard anatomical elements and a dynamic body fluid system complete the setup. The evaluation of the simulator by a medical expert shows that the anatomical geometries are realistic; the material properties however still need improvement.
Authors with CRIS profile
Hannah Riedle
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Jörg Franke
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Involved external institutions
Austria (AT)How to cite
APA:
Riedle, H., Wittmann, P., Franke, J., & Rössler, K. (2019). Design and Fabrication of a Multi-Material Neurosurgical Simulator for an Endoscopic Third Ventriculostomy. In BMEiCON 2019 - 12th Biomedical Engineering International Conference. Ubon Ratchathani, THA: Institute of Electrical and Electronics Engineers Inc..
MLA:
Riedle, Hannah, et al. "Design and Fabrication of a Multi-Material Neurosurgical Simulator for an Endoscopic Third Ventriculostomy." Proceedings of the 12th Biomedical Engineering International Conference, BMEiCON 2019, Ubon Ratchathani, THA Institute of Electrical and Electronics Engineers Inc., 2019.
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