Och A, Holzl PA, Schuster S, Schrattenecker JO, Freidl PF, Scheiblhofer S, Zankl D, Pathuri-Bhuvana V, Weigel R (2020)
Publication Type: Conference contribution
Publication year: 2020
Publisher: Institute of Electrical and Electronics Engineers Inc.
Book Volume: 2020-August
Pages Range: 365-368
Conference Proceedings Title: IEEE MTT-S International Microwave Symposium Digest
Event location: Virtual, Los Angeles, CA
ISBN: 9781728168159
DOI: 10.1109/IMS30576.2020.9224048
Tomographic microwave imaging is employed in numerous industrial applications, e.g., nondestructive testing. However, most existing systems are not suitable for measurements of low-permittivity materials such as gaseous substances or insulating foam with high air content. This paper introduces a 79 GHz high-resolution tomography system enabling characterization of materials with relative permittivity close to one. It is based on fully-integrated frequency-modulated continuous-wave radar transceivers which significantly reduce cost and complexity. A first prototype is built with two radar sensors and a rotary stage to emulate a higher sensor count. The medium-dependent time-of-flight through the area-under-test is evaluated and Tikhonov regularization is applied to solve the inverse problem and reconstruct a 2D image. System simulations and measurements with low-permittivity foam objects confirm the feasibility of this approach.
APA:
Och, A., Holzl, P.A., Schuster, S., Schrattenecker, J.O., Freidl, P.F., Scheiblhofer, S.,... Weigel, R. (2020). High-resolution millimeter-wave tomography system for characterization of low-permittivity materials. In IEEE MTT-S International Microwave Symposium Digest (pp. 365-368). Virtual, Los Angeles, CA, US: Institute of Electrical and Electronics Engineers Inc..
MLA:
Och, Andreas, et al. "High-resolution millimeter-wave tomography system for characterization of low-permittivity materials." Proceedings of the 2020 IEEE/MTT-S International Microwave Symposium, IMS 2020, Virtual, Los Angeles, CA Institute of Electrical and Electronics Engineers Inc., 2020. 365-368.
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