Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface

Kohlhepp M, Uggowitzer PJ, Hummel M, Höppel HW (2021)


Publication Type: Journal article

Publication year: 2021

Journal

Original Authors: Marius Kohlhepp, Peter J. Uggowitzer, Marc Hummel, Heinz Werner Höppel

Book Volume: 14

Pages Range: 1580

Issue: 7

DOI: 10.3390/ma14071580

Open Access Link: https://www.mdpi.com/1996-1944/14/7/1580

Abstract

Die soldering of die castings is a serious problem in the aluminum casting industry. The precise mechanism, the influence of the alloy composition, and the options for prevention have not yet been fully elaborated. A well-established solution for alloys with low iron content is the addition of manganese. However, up to 0.8 wt.% is necessary, which increases the amount of brittle phases in the material and consequently reduces ductility. Immersion tests with 1.2343 tool steel and pure aluminum as well as a hypoeutectic AlSi-alloy with Mn, Mo, Co, and Cr additions were carried out to systematically investigate the formation of die soldering. Three different intermetallic layers and a scattered granular intermetallic phase formed at the interface between steel and Al-alloy after immersion into the melt for a duration of 6 min at 710 °C. The combined presence of the irregular, needle-shaped β-Al5FeSi phase and the surrounding alloy was responsible for the bond between the two components. Mn and Mo inhibited the formation of the β-phase, and instead promoted the αC-Al15(Fe,X)3Si2 phase. This led to an evenly running boundary to the AlSi-alloy and thus prevented bonding. Cr has proven to be the most efficient addition against die soldering, with 0.2 wt.% being sufficient. Contrary to the other elements investigated, Cr also reduced the thickness of the intermetallic interface.

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APA:

Kohlhepp, M., Uggowitzer, P.J., Hummel, M., & Höppel, H.W. (2021). Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface. Materials, 14, 1580. https://doi.org/10.3390/ma14071580

MLA:

Kohlhepp, Marius, et al. "Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface." Materials 14 (2021): 1580.

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