Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring

Wang L, Lomakin K, Job A, Süß-Wolf R, Gold G, Franke J (2021)

Publication Type: Conference contribution

Publication year: 2021

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings

Event location: Virtual DE

ISBN: 9781728175096

DOI: 10.1109/MID50463.2021.9361617

Abstract

This paper aims to provide a design approach to predict the attenuation of microstrip transmission lines fabricated by Laser Direct Structuring (LDS) on LDS polymer substrates. The impact of conductor and dielectric losses are separately considered in full wave simulation to evaluate the order of corresponding contribution to the total attenuation. Impact of surface roughness on signal propagation is taken into account by the Gradient Model. Simulations are compared with measurements of fabricated microstrip lines. The result also gives an estimation on the applicability of the LDS process towards radio frequency components.

Authors with CRIS profile

Li Wang Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Konstantin Lomakin Lehrstuhl für Hochfrequenztechnik (LHFT) Robert Süß-Wolf Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Gerald Gold Professur für Rechnergestützten Schaltungsentwurf Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

How to cite

APA:

Wang, L., Lomakin, K., Job, A., Süß-Wolf, R., Gold, G., & Franke, J. (2021). Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring. In 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Virtual, DE: Institute of Electrical and Electronics Engineers Inc..

MLA:

Wang, Li, et al. "Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring." Proceedings of the 14th International Congress Molded Interconnect Devices, MID 2021, Virtual Institute of Electrical and Electronics Engineers Inc., 2021.

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