Sintering of digitally printed silver nanoparticle inks on flexible and rigid substrates by NIR- And UVradiation
Roudenko J, Neermann S, Schirmer J, Reichenberger M, Franke J (2021)
Publication Type: Conference contribution
Publication year: 2021
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings
ISBN: 9781728175096
DOI: 10.1109/MID50463.2021.9361627
Abstract
In the research project AVerdi the influence of photonic sintering methods on the resulting electrical conductivity, sintering duration and adhesion of digitally printed silver nanoparticle inks was investigated and compared to convective sintering. Conductor paths with film thicknesses below 1 \mu \mathrm{m} were applied on flexible polymer substrates via inkjet printing. Aerosoljet printing was used to generate thicker lines up to 11 \mu \mathrm{m} on injection molded substrates. Photonic sintering was carried out with near infrared emitters or ultraviolet light emitting diodes. For inkjet printed structures on polyimide a conductivity up to 24 % relative to bulk silver was achieved after a sintering duration of 2 s and 5 s for the near infrared and the ultraviolet light source, respectively. Oven sintered samples showed an electrical conductivity of 14 % after 1 h at 200° C. On polyethylene terephthalate a conductivity around 7 % was achieved after irradiation with near infrared light for 1 s, whereas convectively sintered samples showed a conductivity around 4 %. All material combinations sintered by the different methods showed good adhesion. The overall results of long-term behavior after thermal-cycling, regarding electrical conductivity and adhesion, show that the photonically sintered structures achieve similar results compared to the reference. The photonically sintered structures generated with the aerosoljet on polyamide 6 achieved conductivity values up to 19 %, which were comparable to the furnace sintered reference samples. On liquid crystal polymer substrates conductivity values reached up to 35 % after sintering with ultraviolet light emitting diodes for 60 s. Oven sintered samples showed a conductivity around 25 % after 1 h at 150° C. The adhesion of the silver nanoparticle ink on liquid crystal polymer and polyamide 6 substrates is better than with the reference samples. The reliability tests show fewer failures with alternative sintered samples. In this study only the results for inkjet printed structures are presented.
Authors with CRIS profile
Simone Neermann
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
Jörg Franke
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
Involved external institutions
Germany (DE)How to cite
APA:
Roudenko, J., Neermann, S., Schirmer, J., Reichenberger, M., & Franke, J. (2021). Sintering of digitally printed silver nanoparticle inks on flexible and rigid substrates by NIR- And UVradiation. In 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc..
MLA:
Roudenko, Jewgeni, et al. "Sintering of digitally printed silver nanoparticle inks on flexible and rigid substrates by NIR- And UVradiation." Proceedings of the 14th International Congress Molded Interconnect Devices, MID 2021 Institute of Electrical and Electronics Engineers Inc., 2021.
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