Recent Trends in Wafer-Level Package Technology

Schmidbauer P, Wojnowski M, Pressel K, Weigel R, Hagelauer AM (2020)

Publication Type: Conference contribution, Conference Contribution

Publication year: 2020

DOI: 10.1109/iws49314.2020.9360140

Authors with CRIS profile

Philipp Schmidbauer Lehrstuhl für Technische Elektronik Robert Weigel Lehrstuhl für Technische Elektronik Amelie Marietta Hagelauer Lehrstuhl für Technische Elektronik

Involved external institutions

Infineon Technologies AG DE Germany (DE)

How to cite

APA:

Schmidbauer, P., Wojnowski, M., Pressel, K., Weigel, R., & Hagelauer, A.M. (2020). Recent Trends in Wafer-Level Package Technology. In Proceedings of the International Wireless Symposium.

MLA:

Schmidbauer, Philipp, et al. "Recent Trends in Wafer-Level Package Technology." Proceedings of the International Wireless Symposium 2020.

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