Modeling and Measurement of RF-Emissions at Transceiver Pins in Automotive System ICs caused by Integrated DC/DC-Converters
Schade A, Klotz F, Jahn S, Weigel R (2020)
Publication Type: Conference contribution
Publication year: 2020
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: Proceedings of the 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, EMC EUROPE 2020
ISBN: 9781728155791
DOI: 10.1109/EMCEUROPE48519.2020.9245833
Abstract
The integration of DC/DC converters with transceivers in automotive system ICs leads to new challenges regarding the compliance with EMI limit values at the transceiver pins. We quantify the RF-emissions of a DC/DC converter at different transceiver pins of a test IC by measurement and simulation. The substrate coupling path is modeled using a novel substrate extractor, and a HFSS package model is used to describe the inductive bond wire couplings. Our composite model accurately predicts the emissions, and deviates from the measurement by typically less than ±6dB up to 1GHz.
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Germany (DE)How to cite
APA:
Schade, A., Klotz, F., Jahn, S., & Weigel, R. (2020). Modeling and Measurement of RF-Emissions at Transceiver Pins in Automotive System ICs caused by Integrated DC/DC-Converters. In Proceedings of the 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, EMC EUROPE 2020. Institute of Electrical and Electronics Engineers Inc..
MLA:
Schade, Alexander, et al. "Modeling and Measurement of RF-Emissions at Transceiver Pins in Automotive System ICs caused by Integrated DC/DC-Converters." Proceedings of the 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, EMC EUROPE 2020 Institute of Electrical and Electronics Engineers Inc., 2020.
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