RAP Model - Enabling Cross-Layer Analysis and Optimization for System-on-Chip Resilience

Herkersdorf A, Engel M, Glaß M, Henkel J, Kleeberger VB, Kühn JM, Marwedel P, Mueller-Gritschneder D, Nassif SR, Rehman S, Rosenstiel W, Schlichtmann U, Shafique M, Teich J, Wehn N, Weis C (2020)

Publication Type: Book chapter / Article in edited volumes

Publication year: 2020

Edited Volumes: Dependable Embedded Systems

ISBN: 978-3-030-52017-5

DOI: 10.1007/978-3-030-52017-5_1

Authors with CRIS profile

Jürgen Teich Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)

Involved external institutions

Technische Universität München (TUM) DE Germany (DE) NTNU Trondheim - Norwegian University of Science and Technology NO Norway (NO) Technische Universität Wien / Vienna University of Technology AT Austria (AT) Preferred Networks, Inc. JP Japan (JP) Technische Universität Kaiserslautern DE Germany (DE) Eberhard Karls Universität Tübingen DE Germany (DE) Radyalis LLC US United States (USA) (US) Universität Ulm DE Germany (DE) Technische Universität Dortmund DE Germany (DE) Karlsruhe Institute of Technology (KIT) DE Germany (DE) Infineon Technologies AG DE Germany (DE)

How to cite

APA:

Herkersdorf, A., Engel, M., Glaß, M., Henkel, J., Kleeberger, V.B., Kühn, J.M.,... Weis, C. (2020). RAP Model - Enabling Cross-Layer Analysis and Optimization for System-on-Chip Resilience. In Henkel, Jörg, Dutt, Nikil (Eds.), Dependable Embedded Systems..

MLA:

Herkersdorf, Andreas, et al. "RAP Model - Enabling Cross-Layer Analysis and Optimization for System-on-Chip Resilience." Dependable Embedded Systems. Ed. Henkel, Jörg, Dutt, Nikil, 2020.

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