High-resolution, three-dimensional investigation of protein diffusion and trafficking in the live HeLa cell via interferometrie scattering microscopy (iSCAT)

Taylor R, Mahmoodabadi RG, Schambony A, Sandoghdar V (2019)


Publication Type: Conference contribution

Publication year: 2019

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019

Event location: Munich DE

ISBN: 9781728104690

DOI: 10.1109/CLEOE-EQEC.2019.8872206

Abstract

Transmembrane proteins exhibit a wide variety of mobility in live cells, including diffusion in the plasma membrane and directed transport into the cell via endocytosis. Although a great deal has been uncovered about the biochemistry underlying these processes, their real-time visualisation in situ with the necessary nanoscopic resolution remains a daunting experimental challenge. Conventional microscopies rely on fluorescent labelling to monitor diffusion of such proteins within live cells. The resolution in both space and time by which one can successfully determine the position of the protein is curtailed by the finite and limited emission rate of the fluorophore.

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How to cite

APA:

Taylor, R., Mahmoodabadi, R.G., Schambony, A., & Sandoghdar, V. (2019). High-resolution, three-dimensional investigation of protein diffusion and trafficking in the live HeLa cell via interferometrie scattering microscopy (iSCAT). In 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019. Munich, DE: Institute of Electrical and Electronics Engineers Inc..

MLA:

Taylor, Richard, et al. "High-resolution, three-dimensional investigation of protein diffusion and trafficking in the live HeLa cell via interferometrie scattering microscopy (iSCAT)." Proceedings of the 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019, Munich Institute of Electrical and Electronics Engineers Inc., 2019.

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