3D Printed E-Band Hybrid Coupler

Lomakin K, Klein L, Ringel L, Ringel J, Sippel M, Helmreich K, Gold G (2019)

Publication Language: English

Publication Type: Journal article, Review article

Publication year: 2019

Journal

IEEE Microwave and Wireless Components Letters Institute of Electrical and Electronics Engineers (IEEE)

Book Volume: 29

Pages Range: 580-582

Journal Issue: 9

DOI: 10.1109/LMWC.2019.2931458

Abstract

In this work, an additively manufactured 3dB hybrid coupler is presented. While the geometrical structure is generated by an SLA printer from UV curable photopolymer resin as one single part, conductive coating is provided by an electroless silverplating process. The utilized slotted waveguide approach improves the solvent flow during metal plating and therefore enables the fabrication of complex waveguide struc- tures. Measured imbalance between the through and coupling port stays below 1.5dB over the entire E-Band, while the respective phase difference ranges only between 87◦ and 91◦ degrees despite the challenges of additive manufacturing in such frequency regions.

Authors with CRIS profile

Konstantin Lomakin Lehrstuhl für Hochfrequenztechnik (LHFT) Laura Klein Lehrstuhl für Hochfrequenztechnik (LHFT) Johannes Ringel Lehrstuhl für Hochfrequenztechnik (LHFT) Mark Sippel Lehrstuhl für Hochfrequenztechnik (LHFT) Klaus Helmreich Professur für Rechnergestützten Schaltungsentwurf Gerald Gold Professur für Rechnergestützten Schaltungsentwurf

How to cite

APA:

Lomakin, K., Klein, L., Ringel, L., Ringel, J., Sippel, M., Helmreich, K., & Gold, G. (2019). 3D Printed E-Band Hybrid Coupler. IEEE Microwave and Wireless Components Letters, 29(9), 580-582. https://doi.org/10.1109/LMWC.2019.2931458

MLA:

Lomakin, Konstantin, et al. "3D Printed E-Band Hybrid Coupler." IEEE Microwave and Wireless Components Letters 29.9 (2019): 580-582.

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