Experimental investigations on high-precision microcutting of copper foils with microfabricated silicon punches

Hildering S, Becsi L, Engel U, Merklein M, Mescheder U (2012)

Publication Type: Conference contribution

Publication year: 2012

Publisher: euspen

Book Volume: 2

Pages Range: 177-180

Conference Proceedings Title: Proc. 12th Int. Conf. European Society for Precision Engineering and Nanotechnology

Event location: Cranfield

ISBN: 9780956679000

Abstract

The miniaturisation of metallic parts is considerable in various industrial sectors. This trend leads to a demand for decreasing tool dimensions. This study shows the application of monocrystalline silicon as tool material for etched punches used for microcutting of thin copper foils, as etching is a common method in microsystems technology for the economical fabrication of thin vertical structures with a high surface quality. Cutting experiments in a specially designed test rig show the applicability of silicon for microcutting of copper foils and the effect of tool wear on the punching force. The workpiece quality is characterised by a large burnish area of the sheared edges.

Authors with CRIS profile

Sven Hildering Institute of Manufacturing Technology (LFT) Ulf Engel Institute of Manufacturing Technology (LFT) Marion Merklein Institute of Manufacturing Technology (LFT)

Additional Organisation(s)

Institute of Manufacturing Technology (LFT)

Involved external institutions

Hochschule Furtwangen DE Germany (DE)

How to cite

APA:

Hildering, S., Becsi, L., Engel, U., Merklein, M., & Mescheder, U. (2012). Experimental investigations on high-precision microcutting of copper foils with microfabricated silicon punches. In Shore, P.; Spaan, H.; Burke, T. (Eds.), Proc. 12th Int. Conf. European Society for Precision Engineering and Nanotechnology (pp. 177-180). Cranfield: euspen.

MLA:

Hildering, Sven, et al. "Experimental investigations on high-precision microcutting of copper foils with microfabricated silicon punches." Proceedings of the Proc. 12th Int. Conf. European Society for Precision Engineering and Nanotechnology, Cranfield Ed. Shore, P.; Spaan, H.; Burke, T., euspen, 2012. 177-180.

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