High-precision blanking of thin copper foils using uncoated and coated monocrystalline silicon punches

Hildering S, Becsi L, Engel U, Merklein M, Mescheder U (2011)

Publication Type: Conference contribution

Publication year: 2011

Publisher: Research Publ.

Pages Range: 191-195

Conference Proceedings Title: Proc. 8th Int. Conf. Multi-Material Micro Manufacture

Authors with CRIS profile

Sven Hildering Institute of Manufacturing Technology Ulf Engel Technische Fakultät Marion Merklein Institute of Manufacturing Technology

Additional Organisation(s)

Institute of Manufacturing Technology

How to cite

APA:

Hildering, S., Becsi, L., Engel, U., Merklein, M., & Mescheder, U. (2011). High-precision blanking of thin copper foils using uncoated and coated monocrystalline silicon punches. In Kück, H.; Reinecke, H.; Dimov, S. (Eds.), Proc. 8th Int. Conf. Multi-Material Micro Manufacture (pp. 191-195). Research Publ..

MLA:

Hildering, Sven, et al. "High-precision blanking of thin copper foils using uncoated and coated monocrystalline silicon punches." Proceedings of the 8th Int. Conf. Multi-Material Micro Manufacture Ed. Kück, H.; Reinecke, H.; Dimov, S., Research Publ., 2011. 191-195.

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