Roßmanith H (2006)
Publication Status: Published
Publication Type: Conference contribution, Conference Contribution
Publication year: 2006
Pages Range: 613-620
Event location: Dusseldorf
ISBN: 9783800729333
URI: https://www.scopus.com/record/display.uri?eid=2-s2.0-84881435331&origin=inward
APA:
Roßmanith, H. (2006). EMC integration in the layout process using the example of a combination of microstrip and tri-lines EMV-integration in den layout-prozess am beispiel einer kombination von mikrostreifen- und triplate-leitungen. In Proceedings of the International Trade Fair and Conference on Electromagnetic Compatibility, EMC 2006 (pp. 613-620). Dusseldorf.
MLA:
Roßmanith, Hans. "EMC integration in the layout process using the example of a combination of microstrip and tri-lines EMV-integration in den layout-prozess am beispiel einer kombination von mikrostreifen- und triplate-leitungen." Proceedings of the International Trade Fair and Conference on Electromagnetic Compatibility, EMC 2006, Dusseldorf 2006. 613-620.
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