Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin

Groh J, Lee W, Schür J, Distler F, Vossiek M (2018)

Publication Language: English

Publication Type: Conference contribution

Publication year: 2018

Conference Proceedings Title: 48th European Microwave Conference (EuMW 2018)

DOI: 10.23919/EuMC.2018.8541434

Authors with CRIS profile

Jannis Groh Lehrstuhl für Hochfrequenztechnik (LHFT) William Lee Lehrstuhl für Hochfrequenztechnik (LHFT) Jan Steffen Schür Lehrstuhl für Hochfrequenztechnik (LHFT) Felix Distler Lehrstuhl für Hochfrequenztechnik (LHFT) Martin Vossiek Lehrstuhl für Hochfrequenztechnik (LHFT)

How to cite

APA:

Groh, J., Lee, W., Schür, J., Distler, F., & Vossiek, M. (2018). Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin. In 48th European Microwave Conference (EuMW 2018).

MLA:

Groh, Jannis, et al. "Compact Substrate Integrated Wireless Cure Monitoring Sensor for Epoxy Resin." Proceedings of the 48th European Microwave Conference (EuMW 2018) 2018.

BibTeX: Download