Substituting bond wires by additively manufactured interconnections

Lomakin K, Sippel M, Gold G, Ringel J, Weiß D, Helmreich K, Ankenbrand M, Franke J (2018)

Publication Language: English

Publication Type: Conference contribution

Publication year: 2018

Conference Proceedings Title: German Microwave Conference

DOI: 10.23919/gemic.2018.8335106


This work shows a comparison of microstrip to integrated circuits junction between conventional bond wires and additively manufactured signal interconnect. Therefore, an approach for reducing signal reflection is proposed and implemented on a test board fabricated on typical radio frequency substrate material. Measurements up to 24 GHz reveal improved performance as compared to conventional technology in terms of reflection suppression and transmission losses.

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How to cite


Lomakin, K., Sippel, M., Gold, G., Ringel, J., Weiß, D., Helmreich, K.,... Franke, J. (2018). Substituting bond wires by additively manufactured interconnections. In German Microwave Conference.


Lomakin, Konstantin, et al. "Substituting bond wires by additively manufactured interconnections." Proceedings of the German Microwave Conference 2018.

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