Silva Cortes VA, Liu L, Stehr U, Fischer M, Frank A, Chauhan V, Hein M, Müller J, Weigel R, Fischer G, Hagelauer AM (2017)
Publication Language: English
Publication Type: Conference contribution, Original article
Publication year: 2017
Pages Range: 448-451
Conference Proceedings Title: Asia Pacific Microwave Conference
ISBN: 978-1-5386-0640-7
URI: http://ieeexplore.ieee.org/document/8251477/
DOI: 10.1109/APMC.2017.8251477
The present paper demonstrates the design of a power amplifier (PA) module on a silicon ceramic (SiCer) composite substrate. The SiCer platform combines the advantages of low temperature co-fired ceramic (LTCC) and silicon thin-film processing technology for micro-electro-mechanical systems (MEMS) in a quasi-monolithic composite substrate. The present approach provides a methodology for the design and manufacturing of a PA module that foresees further integration with MEMS modules such as switches, oscillators, and acoustic filters. Based on a co-simulation approach in a specification-compliant software and polyharmonic distortion modeling, the impact of the PA module in a long term evolution (LTE) transmitter is evaluated.
APA:
Silva Cortes, V.A., Liu, L., Stehr, U., Fischer, M., Frank, A., Chauhan, V.,... Hagelauer, A.M. (2017). Design of a Power Amplifier Module in a Novel Silicon-Ceramic Substrate for an LTE Transmitter. In Asia Pacific Microwave Conference (pp. 448-451). Kuala Lumpar, MY.
MLA:
Silva Cortes, Victor Arturo, et al. "Design of a Power Amplifier Module in a Novel Silicon-Ceramic Substrate for an LTE Transmitter." Proceedings of the Asia Pacific Microwave Conference, Kuala Lumpar 2017. 448-451.
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