Impact of technology scaling on electrical characteristics of through-silicon via correlated with equivalent circuits

Lee HM, Liu EX, Li EP, Fuhrmann J (2011)

Publication Type: Conference contribution, Conference Contribution

Publication year: 2011

ISBN: 978-0-9541146-3-3

Authors with CRIS profile

Jörg Fuhrmann Lehrstuhl für Technische Elektronik

Involved external institutions

Agency for Science, Technology and Research (A*STAR) SG Singapore (SG)

How to cite

APA:

Lee, H.M., Liu, E.-X., Li, E.-P., & Fuhrmann, J. (2011). Impact of technology scaling on electrical characteristics of through-silicon via correlated with equivalent circuits. In Proceedings of the EMC Europe 2011 York.

MLA:

Lee, Hui Min, et al. "Impact of technology scaling on electrical characteristics of through-silicon via correlated with equivalent circuits." Proceedings of the EMC Europe 2011 York 2011.

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