Cross-Layer Dependability Modeling and Abstraction in System on Chip

Herkersdorf A, Engel M, Glaß M, Henkel J, Kleeberger VB, Kochte MA, Kühn JM, Nassif SR, Rauchfuss H, Rosenstiel W, Schlichtmann U, Shafique M, Tahoori MB, Teich J, Wehn N, Weis C, Wunderlich HJ (2013)

Publication Type: Conference contribution

Publication year: 2013

Publisher: Elsevier

City/Town: München

Pages Range: 1-7

Conference Proceedings Title: Proc. 9th Workshop on Silicon Errors in Logic - System Effects

Event location: Palo Alto, CA US

URI: http://www.selse.org

Authors with CRIS profile

Michael Glaß Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design) Jürgen Teich Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)

Involved external institutions

Technische Universität München (TUM) DE Germany (DE) Technische Universität Dortmund DE Germany (DE) Karlsruhe Institute of Technology (KIT) DE Germany (DE) Universität Stuttgart DE Germany (DE) Eberhard Karls Universität Tübingen DE Germany (DE) IBM Zurich Research Laboratory CH Switzerland (CH) Technische Universität Kaiserslautern DE Germany (DE)

How to cite

APA:

Herkersdorf, A., Engel, M., Glaß, M., Henkel, J., Kleeberger, V.B., Kochte, M.A.,... Wunderlich, H.J. (2013). Cross-Layer Dependability Modeling and Abstraction in System on Chip. In Proc. 9th Workshop on Silicon Errors in Logic - System Effects (pp. 1-7). Palo Alto, CA, US: München: Elsevier.

MLA:

Herkersdorf, Andreas, et al. "Cross-Layer Dependability Modeling and Abstraction in System on Chip." Proceedings of the 9th Workshop on Silicon Errors in Logic - System Effects (SELSE), Palo Alto, CA München: Elsevier, 2013. 1-7.

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